Texas Instruments MagPack Technology: The New Standard in Power Module Design

As the performance requirements of power supply modules for electronic devices continue to increase, Texas Instruments (Texas Instruments, TI) has introduced its innovative MagPack™ packaging technology. This technology significantly improves the power density and efficiency of power modules by highly integrating the power chip with the transformer or inductor through a unique 3D packaging process. The following are the four main advantages of MagPack technology:

Miniaturisation and High Power Density

One of the biggest highlights of MagPack technology is its remarkable miniaturisation capability. Power modules with MagPack technology can be up to 50% smaller in size compared to conventional power modules. For example, the TPSM82866A and TPSM82866C modules are capable of delivering a current output capability of 1A per square millimetre in a size of only 2.3mm x 3mm. In comparison, conventional power supply modules are typically 5mm x 5mm or larger. This high power density design allows engineers to achieve higher power outputs in a limited space, meeting the increasingly compact design requirements of modern electronic devices.

High Efficiency and Excellent Thermal Performance

MagPack technology is not only a breakthrough in size, but also excels in efficiency and thermal performance. The new power modules offer up to 2% improvement in conversion efficiency and approximately 17% reduction in thermal resistance. For example, some MagPack modules can achieve efficiencies of over 95% at high loads. This means that for the same power output, the module generates less heat, which extends equipment life and improves overall system reliability. This advantage is particularly important in applications such as data centres, where power efficiency is critical, and where the cost of power accounts for a significant portion of operating costs.

Ease of Use and Reduced Time to Market

MagPack technology is designed to simplify the integration process of power modules, allowing engineers to design with fewer components and less complexity. For example, while a traditional design may require multiple discrete components, MagPack modules integrate these components together, reducing board wiring complexity. This integrated design not only improves product ease of use, but also significantly shortens product development and time-to-market cycles. Designers are able to bring their products to market faster, giving them a leg up on the competition.

Reducing Electromagnetic Interference (EMI)

Electromagnetic interference (EMI) is an important consideration in power supply design, and MagPack technology excels in this area. Power modules using this technology are able to reduce EMI radiation by 8dB, which is effective for applications in industrial, enterprise, and communications applications to improve the stability and reliability of equipment. By reducing EMI, designers can more easily meet stringent EMI standards and ensure product compliance. For example, many industry standards such as CISPR 22 and EN 55022 have clear limits on EMI, and MagPack technology can help products pass these tests more easily.

In short, Texas Instruments' MagPack technology redefines the design standards for power modules through four major advantages: miniaturisation, high efficiency, ease of use and low EMI. This technology not only meets the demand for high power density of modern electronic equipment, but also provides engineers with more design flexibility and promotes the further development of power management technology. As TI continues to expand the scope of application of MagPack technology, there will be more innovative products in the future, to help all walks of life power design.

To learn more about MagPack technology, click here.

Disclaimer: The information provided on this page is for informational purposes only. We do not warrant the accuracy or completeness of the information and accept no liability for any loss or damage arising from the use of such information.